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BGA Reballing Šablona za Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Sajenje Tin Predlogo Povečaj

BGA Reballing Šablona za Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Sajenje Tin Predlogo

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BGA Reballing Šablona za Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Sajenje Tin Opis Predloge: Visoka Kakovost BGA Matrice.Posebej izdelana za Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU.Bi vaš popravila delo lažje.Material: Nerjaveče Jeklo Debelina:0.12 mm

Oznake: rebal postaja, macbook matrica, bga samsung, fan nitro, matrica mobilni telefon, bga, da lga, prikaz nohtov, bga emmc matrica, bga rebal kit, emmc reball matrica.

Podatki

Slog BGA Šablona za Samsung J1/J2/J3/J4/J100H/J320F/G570M
Uporaba BGA Reballing za SC9830A/7730S
Funkcija BGA Reballing za Samsung Exynos7570/3475
Velikost Delcev 1-10µm
Številka Modela BGA reballing
Material Nerjaveče Jeklo
Debelina 0.12 mm

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BGA Reballing Šablona za Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Sajenje Tin Predlogo

BGA Reballing Šablona za Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Sajenje Tin Predlogo

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